SPM Printed Circuit Board Assembly operations are designed to provide flexibility to meet the various unique requirements of our customers. Our experience in handling high mix volumes has resulted in our team’s strong capability in handling frequent changeovers.

Technology Capability – Process

  • Surface Mount Technology (SMT)
  • Pin-Through-Hole (PTH)
  • RoHS and Leaded Process Capabilities
  • Rigid PCB, Rigid-Flex PCB & Flex circuit board
  • In-Circuit and Custom Functional test
  • Automatic Optical Inspection (AOI)
  • Conformal coating
  • RF Testing
  • Quick-turn Prototyping
  • Reliability testing with Climate Test Chambers
  • IPC-610-D Standard compliance

Technology Capability – Components

  • Fine pitch QFP
  • BGA/ Micro-BGA
  • Chip Scale Package (CSP)
  • 0201 size components
  • Optical Actives and Passives
  • Connectors